As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life.
Molex is a leading one-source supplier of interconnect products. Our team of highly skilled experts is focused on the design, development and distribution of innovative product solutions that touch virtually every walk of life. Our portfolio is among the world's most extensive, with over 100,000 reliable products, including everything from electronic, electrical and fiber optic interconnects to switches and application tooling.
We leverage extensive worldwide resources to meet customer needs on a local, regional and global level. Molex offers well-established sales, product development, manufacturing and logistics resources in Asia, Europe and the Americas. Our engineering, development and manufacturing capabilities are organized into three product divisions, all serviced by the Molex Global Sales and Marketing Division.
Commercial Products Division: Develops and manufactures multi-market products for a diverse range of applications. The division's new product activities are focused into two main areas: high-speed, high-density, high-signal-integrity interconnect applications; and interconnect solutions for advanced engine, cockpit and infotainment functions in automobiles and other transportation equipment.
Micro Products Division: Known for developing the smallest connectors in the world, the Micro Products division is focused on portable digital product applications. This division has a number of business units. Among these is Molex Kiire, the business unit created to accommodate the 2008 acquisition of Fuchigami Micro. Fuchigami Micro was known in advanced technical circles for solving unique problems with custom electromechanical components of the smallest size. The business unit's capabilities including photolithography, micro-etch and small scale thermal dissipation technology.
Integrated Products Division: Produces higher-level assemblies utilizing Molex interconnect technologies, typically in printed circuit board, fiber optic, flex circuit and other ap