Описание
Laser-drilled Micro-Vias reduce the space required by through-the-board vias. They are smaller in diameter, and because of this, more space can be devoted to circuit traces. As PCBs continue to decrease in size and increase in complexity, your PCB fabricator has to keep up. As a designer, you certainly understand that old processes are revised and new ones are added, including those needed for High-Density Interconnect (HDI). As your PCB fabricator, RUSH PCB is always working to stay ahead of the game!
